Electronic component and board having the same mounted thereon

ABSTRACT

An electronic component and a board having the same mounted thereon are provided. The electronic component includes an electronic component including a capacitor array in which a plurality of multilayer capacitors including a capacitor body and a pair of external electrodes, respectively disposed on both end portions of the capacitor body in a first direction, are stacked in a second direction, perpendicular to the first direction, and a length of a multilayer capacitor, disposed on a lower end in the second direction, in the first direction is less than a length of another multilayer capacitor in the first direction; and a pair of metal frames, respectively disposed to be connected to the pair of external electrodes of the multilayer capacitor disposed on the lower end.

CROSS-REFERENCE TO RELATED APPLICATION(S)

The present application claims the benefit of priority to Korean PatentApplication No. 10-2020-0115241, filed on Sep. 9, 2020 in the KoreanIntellectual Property Office, the entire disclosure of which isincorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to an electronic component and a boardhaving the same mounted thereon.

BACKGROUND

Multilayer capacitors are used in various electronic devices due to asmall size and high capacitance thereof.

Recently, due to fast growing interest in eco-friendly vehicles andelectric vehicles, the importance of power driving systems in vehiclesis increasing, and accordingly, demand for multilayer capacitorsrequired for power driving systems is also increasing.

Multilayer capacitors are required to have high levels of thermalreliability, electrical reliability, and mechanical reliability, so asto be used as components for a vehicle.

With an increase in component-mounting density in a vehicle, there isdemand for a multilayer capacitor which may be easily mounted in alimited space while implementing high capacitance and which may behighly resistant to vibrations and deformation.

To improve durability against such vibrations and deformation, amultilayer capacitor may be mounted on a board while being spaced apartfrom the board using a metal frame.

In addition, a plurality of multilayer capacitors may be stacked toimplement high capacitance in a similar area.

However, in the case of an electronic component having a multi-stackstructure using a metal frame, a length of the electronic component isincreased by thicknesses of the metal frame and a conductive bondinglayer. Therefore, a mounting area is increased by the increased lengthof the electronic component during board mounting. As a result, a designof an electrode pad of a board should be changed.

SUMMARY

An aspect of the present disclosure is to provide an electroniccomponent, which may implement high capacitance and improve durabilityagainst vibrations and deformation and may be used without increasing amounting area when mounted on a board and changing a design of anelectrode pad of the board, and a board having the electronic componentmounted thereon.

According to an aspect of the present disclosure, an electroniccomponent includes a capacitor array in which a plurality of multilayercapacitors including a capacitor body and a pair of external electrodes,respectively disposed on both end portions of the capacitor body in afirst direction, are stacked in a second direction, perpendicular to thefirst direction, and a length of a multilayer capacitor, disposed on alower end in the second direction, in the first direction, is less thana length of another multilayer capacitor in the first direction; and apair of metal frames, respectively disposed to be connected to the pairof external electrodes of the multilayer capacitor disposed on the lowerend.

The capacitor body may include a dielectric layer and a plurality ofinternal electrodes alternately disposed with the dielectric layerinterposed therebetween.

The external electrode may include a head portion, disposed on onesurface of the capacitor body in the first direction, and a band portionextending from the head portion to portions of upper and lower surfacesof the capacitor body.

A conductive bonding layer may be disposed between band portions, facingeach other, in multilayer capacitors adjacent to each other in thesecond direction.

The metal frame may include a connection portion, connected to the headportion, and a mounting portion bent to extend from a lower end of theconnection portion in the first direction.

The mounting portion may be spaced apart from a lower end of thecapacitor array.

The electronic component may further include a conductive bonding layerdisposed between the connection portion and the head portion.

Two multilayer capacitors may be stacked from a lower end of thecapacitor array in the second direction in such a manner that portionsof band portions, facing each other, overlap each other in the seconddirection.

In addition, ⅔≤B/A, in which A is a length of the band portion of themultilayer capacitor, disposed on the lower end, in the first direction,and B is a length of the band portions, overlapping each other in thesecond direction, in the first direction.

A length of the band portions, overlapping each other in the seconddirection, in the first direction, may be 0.4 mm or more.

The metal frame may include a bonding portion, bent to extend from anupper end of the connection portion in the first direction, allowing themetal frame to be bonded to a band portion of a multilayer capacitordisposed on an upper side in the capacitor array.

The electronic component may further include a conductive bonding layerdisposed between the bonding portion and the band portion of themultilayer capacitor disposed on the upper side in the capacitor array.

The metal frame may include an extension portion, bent to extend from anupper end of the connection portion in the first direction, and anauxiliary connection portion, bent to extend from the extension portionin the second direction, to be bonded to the head portion of themultilayer capacitor disposed on the upper side in the capacitor array.

The electronic component may further include a conductive bonding layerdisposed between the auxiliary connection portion and the head portionof the multilayer capacitor disposed on the upper side in the capacitorarray.

The auxiliary connection portion may be formed to expose a portion ofthe head portion of the multilayer capacitor disposed on the upper sidein the capacitor array.

According to another aspect of the present disclosure, a board having anelectronic component mounted thereon includes a board, having an uppersurface on which a first electrode pad and a second electrode pad areprovided, and an electronic component mounted in such a manner that asingle mounting portion is connected to each of the first electrode padand the second electrode pad.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings.

FIG. 1 is a schematic perspective view of a multilayer capacitor appliedto an exemplary embodiment of the present disclosure.

FIGS. 2A and 2B are plan views illustrating first and second internalelectrodes, respectively, applied to the multilayer capacitor of FIG. 1.

FIG. 3 is a cross-sectional view taken along line I-I′ of FIG. 1 .

FIG. 4 is a perspective view illustrating a schematic structure of anelectronic component according to an exemplary embodiment of the presentdisclosure.

FIG. 5 is a cross-sectional view taken along line II-II′ of FIG. 4 .

FIG. 6 is a graph illustrating that a detachment rate and relative ESRof a multilayer capacitor disposed above vary depending on anoverlapping length of band portions, vertically facing each other, in acapacitor array of an electronic component according to an exemplaryembodiment of the present disclosure.

FIG. 7 is a cross-sectional view of an electronic component according toanother exemplary embodiment of the present disclosure.

FIG. 8 is a perspective view illustrating a schematic structure of anelectronic component according to another exemplary embodiment of thepresent disclosure.

FIG. 9 is a cross-sectional view taken along line III-III′ of FIG. 8 .

FIG. 10 is a cross-sectional view illustrating a state in which theelectronic component of FIG. 5 is mounted on a board.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be described asfollows with reference to the attached drawings.

The present disclosure may, however, be exemplified in many differentforms and should not be construed as being limited to the specificembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey the scope of the disclosure to those skilled in the art.

Throughout the specification, it will be understood that when anelement, such as a layer, region or wafer (board), is referred to asbeing “on,” “connected to,” or “coupled to” another element, it can bedirectly “on,” “connected to,” or “coupled to” the other element orother elements intervening therebetween may be present. In contrast,when an element is referred to as being “directly on,” “directlyconnected to,” or “directly coupled to” another element, there may be noelements or layers intervening therebetween. Like numerals refer to likeelements throughout. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

It will be apparent that though the terms first, second, third, etc. maybe used herein to describe various members, components, regions, layersand/or sections, these members, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one member, component, region, layer or section fromanother region, layer or section. Thus, a first member, component,region, layer or section discussed below could be termed a secondmember, component, region, layer or section without departing from theteachings of the exemplary embodiments.

Spatially relative terms, such as “above,” “upper,” “below,” and “lower”and the like, may be used herein for ease of description to describe oneelement's relationship to another element(s) as shown in the figures. Itwill be understood that the spatially relative terms are intended toencompass different orientations of the device in use or operation inaddition to the orientation depicted in the figures. For example, if thedevice in the figures is turned over, elements described as “above,” or“upper” other elements would then be oriented “below,” or “lower” theother elements or features. Thus, the term “above” can encompass boththe above and below orientations depending on a particular direction ofthe figures. The device may be otherwise oriented (rotated 90 degrees orat other orientations) and the spatially relative descriptors usedherein may be interpreted accordingly.

The terminology used herein describes particular embodiments only, andthe present disclosure is not limited thereby. As used herein, thesingular forms “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. It willbe further understood that the terms “comprises,” and/or “comprising”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, members, elements, and/or groupsthereof, but do not preclude the presence or addition of one or moreother features, integers, steps, operations, members, elements, and/orgroups thereof.

Hereinafter, embodiments of the present disclosure will be describedwith reference to schematic views illustrating embodiments of thepresent disclosure. In the drawings, for example, due to manufacturingtechniques and/or tolerances, modifications of the shape shown may beestimated. Thus, embodiments of the present disclosure should not beconstrued as being limited to the particular shapes of regions shownherein, for example, to include a change in shape results inmanufacturing. The following embodiments may also be constituted by oneor a combination thereof.

The contents of the present disclosure described below may have avariety of configurations and propose only a required configurationherein, but are not limited thereto.

When orientations are defined to clearly describe an embodiment in thepresent disclosure, X, Y, and Z on the drawings indicate a lengthdirection, a width direction, and a thickness direction of a multilayercapacitor and an electronic component, respectively.

Here, in an embodiment, a Z direction may be used as having the same asa stacking direction in which dielectric layers are stacked on eachother.

FIG. 1 is a schematic perspective view of a multilayer capacitor appliedto an exemplary embodiment, FIGS. 2A and 2B are plan views illustratinga first internal electrode and a second internal electrode,respectively, applied to the multilayer capacitor of FIG. 1 , and FIG. 3is a cross-sectional view taken along line I-I′ of FIG. 1 .

Hereinafter, a structure of a multilayer capacitor 100, applied to anelectronic component of the present embodiment, will be described withreferenced to FIGS. 1 to 3 .

In addition, a second multilayer capacitor to be described later has astructure, in which a capacitor body and first and second electrodes areformed, similar to a structure of the first multilayer capacitor 100.Therefore, a description of the structure of the second multilayercapacitor will be omitted to avoid duplication.

The multilayer capacitor 10 may include a capacitor body 110, and firstand second external electrodes 131 and 132, respectively disposed onboth end portions of the body capacitor 110, in an X direction definedas a first direction.

The capacitor body 110 may be formed by laminating a plurality ofdielectric layers 111 in a Z direction and sintering the laminateddielectric layers 111. Adjacent dielectric layers 111 of the capacitorbody 110 are integrated such that boundaries therebetween are notreadily apparent without using a scanning electron microscope (SEM).

The capacitor body 110 may include a plurality of dielectric layers 111and first and second internal electrodes 121 and 122 alternatelydisposed in the Z direction with respective dielectric layers 111interposed therebetween. The first and second internal electrodes 121and 122 may have polarities opposite to each other.

The capacitor body 110 may include an active region and cover regions112 and 113.

The active region is a portion contributing to formation of capacitanceof a multilayer capacitor.

The cover regions 112 and 113 may be provided on upper and lowerportions of the active region in the Z direction as margin portions,respectively. The cover regions 112 and 113 may be provided bylaminating a single dielectric layer or at least two dielectric layerson an upper surface and a lower surface of the active region,respectively.

The cover regions 112 and 113 may serve to prevent damage to the firstand second internal electrodes 121 and 122 due to physical or chemicalstress.

The capacitor body 110 has a shape without limitation, and may have ahexahedral shape overall.

In the present embodiment, the capacitor body 110 may have a firstsurface 1 and a second surface 2, opposing each other in the Zdirection, a third surface 3 and a fourth surface 4, connected to thefirst surface 1 and the second surface 2 and opposing each other in theX direction, and a fifth surface 5 and a sixth surface 6, connected tothe first surface 1 and the second surface 2 and to the third surface 3and the fourth surface 4 and opposing each other. The first surface 1may be a mounting surface.

A shape and a dimension of the capacitor body 110 and the number oflaminated dielectric layers 111 are not limited to those illustrated inthe drawings of the present embodiment.

The dielectric layer 111 may include ceramic powder, for example, aBaTiO₃-based ceramic powder, or the like.

The BaTiO₃-based ceramic powder may be (Ba_(1-x)Ca_(x))TiO₃,Ba(Ti_(1-y)Ca_(y))O₃, (Ba_(1-x)Ca_(x)) (Ti_(1-y)Zr_(y))O₃,Ba(Ti_(1-y)Zr_(y))O₃, or the like, in which calcium (Ca), zirconium(Zr), or the like, is partially dissolved in BaTiO₃, but is not limitedthereto.

A ceramic additive, an organic solvent, a plasticizer, a binder, adispersant, and the like, may also be added to the dielectric layers111.

The ceramic additive may include, for example, a transition metal oxideor a transition metal carbide, a rare earth element, magnesium (Mg),aluminum (Al), or the like

The first and second internal electrodes 121 and 122 may be electrodesto which voltages having opposite polarities are applied. Each of thefirst and second internal electrodes 121 and 122 may be formed on thedielectric layer 111 and may be laminated in the Z direction.

The first and second internal electrodes 121 and 122 may be alternatelydisposed inside the capacitor body 110 to oppose each other in the Zdirection with a single dielectric layer 111 interposed therebetween. Inthis case, the first and second internal electrodes 121 and 122 may beelectrically insulated from each other by the dielectric layer 111disposed therebetween.

In the present embodiment, a plurality of internal electrodes areillustrated and described as being laminated in the Z direction.However, the present disclosure is not limited thereto and may beapplied to a structure in which internal electrodes are laminated in theY direction, as necessary.

One end of the first internal electrode 121 may be exposed through thethird surface 3 of the capacitor body 110. The end portion of the firstinternal electrode 121, exposed through the third surface 3 of thecapacitor body 110, may be connected to the first external electrode131, disposed on one end portion of the capacitor body 110 in the Xdirection, to be electrically connected thereto.

One end portion of the second internal electrode 121 may be exposedthrough the fourth surface 4 of the capacitor body 110. The end portionof the second internal electrode 122, exposed through the fourth surface4 of the capacitor body 110, may be connected to the second externalelectrode 132, disposed on one end portion of the capacitor body 110 inthe X direction, to be electrically connected thereto.

According to the above configuration, when a predetermined voltage isapplied to the first and second external electrodes 131 and 132, chargesare accumulated between the first and second internal electrodes 121 and122.

In this case, the capacitance of the multilayer capacitor 100 may beproportional to an area of overlap between the first and second internalelectrodes 121 and 122, overlapping in the Z direction in the activeregion.

A material, forming the first and second internal electrodes 121 and122, is not necessarily limited.

For example, the first and second internal electrodes 121 and 122 may beformed using a precious metal material or a conductive paste formed ofat least one of nickel (Ni) and copper (Cu). The precious metal materialmay be platinum (Pt), palladium (Pd), a palladium-silver (Pd—Ag) alloy,or the like.

In this case, a method of printing the conductive paste may be such asscreen printing or gravure printing may be used, but the presentdisclosure is not limited thereto.

Voltages, having opposite polarities, may be provided to the first andsecond external electrodes 131 and 132. The first and second externalelectrodes 131 and 132 may be disposed on both end portions of the body110 in the X direction and may be connected to exposed portions of thefirst and second electrodes 121 and 122, respectively, to beelectrically connected to each other.

The first external electrode 131 may include a first head portion 131 aand a first band portion 131 b.

The first head portion 131 a may be disposed on the third surface 3 ofthe body 110. The first head portion 131 may be in contact with an endportion exposed to an external entity through the third surface 3 of thecapacitor body 110 in the first internal electrode 121 to electricallyconnect the first internal electrode 121 and the first externalelectrode 131 to each other.

The first band portion 131 b is a portion extending from the first bandportion 131 a to portions of the first, second, fifth, and sixthsurfaces 1, 2, 5, and 6, of the body 110. The first band portion mayserve to improve adhesive strength.

The second external electrode 132 may include a second head portion 132a and a second band portion 132 b.

The second head portion 132 a may be disposed on the fourth surface 4 ofthe body 110. The second head portion 132 a may be in contact with anend portion exposed to an external entity through the fourth surface 4of the body 110 in the second internal electrode 122 to electricallyconnect the second internal electrode 122 and the second externalelectrode 132 to each other.

The second band portion 132 b is a portion extending from the secondband portion 132 a to a portion of the first, second, fifth, and sixthsurfaces 1, 2, 5, and 6 of the body 110.

The second band portion 132 b may serve to improve adhesive strength, orthe like.

The second band portion 132 b may further extend to a portion of thefifth and sixth surfaces 5 and 6 of the capacitor body 110, as necessaryfor further improvement of adhesive strength.

The first and second external electrodes 131 and 132 may further includea plating layer.

The plating layer includes first and second nickel (Ni) plating layers,disposed on the capacitor body 110, and first and second tin (Sn)plating layers, respectively covering the first and second nickel (Ni)plating layers.

FIG. 4 is a perspective view illustrating a schematic structure of anelectronic component according to an exemplary embodiment, and FIG. 5 isa cross-sectional view taken along line II-II′ of FIG. 4 .

An electronic component according to the present disclosure includes acapacitor array in which a plurality of multilayer capacitors includinga capacitor body and a pair of external electrodes, respectivelydisposed on both end portions of the capacitor body in a firstdirection, are stacked in a second direction, perpendicular to the firstdirection, and a length of a multilayer capacitor, disposed on a lowerend in the second direction, in the first direction is less than alength of another multilayer capacitor in the first direction; and apair of metal frames, respectively disposed to be connected to the pairof external electrodes of the multilayer capacitor disposed on the lowerend.

In the present disclosure, a capacitor array is illustrated anddescribed as including two multilayer capacitors stacked in a Zdirection. However, the present disclosure is not limited thereto, and acapacitor array according to the present disclosure may be configured insuch a manner that three or more multilayer capacitors are stacked inthe Z direction.

Referring to FIGS. 4 and 5 , an electronic component according to thepresent embodiment may include a capacitor array, including a pluralityof multilayer capacitors, and first and second frames 140 and 150.

In the present disclosure, the capacitor array may include a firstmultilayer capacitor 100, disposed below, and a second multilayercapacitor 101 disposed above. The first multilayer capacitor 100 and thesecond multilayer capacitor 101 are stacked in the Z direction.

In this case, a length of the first multilayer capacitor 100 in an Xdirection may be less than a length of the second multilayer capacitor101 in the X direction.

As necessary, a length of the first multilayer capacitor 100 in a Ydirection may also be less than a length of the second multilayercapacitor 101 in the Y direction.

The second multilayer capacitor 101 may include a third externalelectrode 131′, having a third head portion 131 a′ and a third bandportion 131 b′, and a fourth external electrode 132′ having a fourthhead portion 132 a′ and a fourth band portion 132 b′.

In the first and second multilayer capacitors 100 and 101 adjacent toeach other in the Z direction, a conductive bonding layer 161 may bedisposed between a first band portion 131 b and the third band portion131 b′ facing each other in the Z direction, and a conductive bondinglayer 162 may be disposed between a second band portion 132 b and thefourth band portion 132 b′ facing each other in the Z direction.

In the capacitor array, the first and second metal frames 140 and 150may be disposed to be connected to the first and second externalelectrodes 131 and 132 of the first multilayer capacitor 100,respectively.

The first metal frame 140 may include a first connection portion 141 anda first mounting portion 142.

The first connection portion 141 may be bonded to the first head portion131 a of the first external electrode 131 of the first multilayercapacitor 100 to be physically connected thereto, and may beelectrically connected to the first head portion 131 a of the firstexternal electrode 131.

In this case, the first connection portion 141 may be formed such thatan upper end of the first connection portion 141 is in physical contactwith the third band portion 131 b′ of the third external electrode 131′.

A conductive bonding layer 163 may be disposed between the first headportion 131 a of the external electrode 131 and the first connectionportion 141.

The conductive bonding layer 163 may be connected to the conductivebonding layer 161, disposed between the first and third band portions131 b and 131 b′, to be integrally provided.

The conductive bonding layer 163 may be formed of a high-temperaturesolder, a conductive bonding material, or the like, but the presentdisclosure is not limited thereto.

The first mounting portion 142 may be bent to extend inwardly of thefirst connection portion 141 from a lower end of the first connectionportion 141 in a horizontal direction with respect to a mountingsurface.

The first mounting portion 142 may serve as a connection terminal whenthe electronic component is mounted on a board.

In this case, the first mounting portion 142 may be disposed to bespaced apart from a lower end of the first multilayer capacitor 100.

The second metal frame 150 may include a second connection portion 151and a second mounting portion 152.

The second connection portion 151 may be bonded to the second headportion 132 a of the second external electrode 132 to be physicallyconnected thereto, and may be electrically connected to the second headportion 132 a of the second external electrode 132.

In this case, the second connection portion 151 may be formed in such amanner that an upper end of the second connection portion 151 is inphysical contact with the fourth band portion 132 b′ of the fourthexternal electrode 132′ of the second multilayer capacitor 101.

A conductive bonding layer 164 may be disposed been the second headportion 132 a of the second external electrode 132 and the secondconnection portion 151.

The conductive bonding layer 164 may be connected to the conductivebonding layer 166, disposed between the second and fourth band portions132 b and 132 b′, to be integrally provided.

The conductive bonding layer 164 may be formed of a high-temperaturesolder, a conductive bonding material, or the like, but the presentdisclosure is not limited thereto.

The second mounting portion 152 may be bent to extend inwardly of thesecond connection portion 151 from a lower end of the second connectionportion 151 in a horizontal direction with respect to the mountingsurface.

The second mounting portion 152 may serve as a connection terminal whenthe electronic component is mounted on the board.

In this case, the second mounting portion 152 may be disposed to bespaced apart from a lower end of the first multilayer capacitor 100.

According to the present embodiment, the first and second multilayercapacitors 100 and 101 may be stacked in the Z direction to increasecapacitance of the electronic component.

The first and second metal frames 140 and 150 may be bonded to the firstand second external electrodes 131 and 132. In this case, a length ofthe first multilayer capacitor 100, close to the mounting surface of theboard, in the X direction may be less than a length of the secondmultilayer capacitor 101, disposed above, in the X direction.

As compared to the case in which a second multilayer capacitor isdirectly mounted on a board without a metal frame when an electroniccomponent is mounted on the board, in the present embodiment, amountingarea of the electronic component may not be increased and an electrodepad of the board may be used, as it is, without changing an existingdesign for a size and a position of the electrode pad.

In this case, when the length of the first multilayer capacitor 100 inthe X direction, thicknesses of the conductive bonding layers 163 and164 and the first and second connection portions 141 and 151 of thefirst and second metal frames 140 and 150, and the like, are adjusted, alength from an external end surface of the first connection portion 141in the X direction to an external end surface of the second connectionportion 151 in the X direction may be similar to or less than the lengthof the second multilayer capacitor 101 in the X direction.

A conductive bonding layer 163 may be disposed between the first headportion 131 a of the first external electrode 131 of the firstmultilayer capacitor 100 and the first connection portion 141 of thefirst metal frame 140, and a conductive bonding layer 161 may bedisposed between the first band portion 131 b of the first externalelectrode 131 and the third band portion 131 b′ of the third externalelectrode 131′ facing each other in the Z direction. Thus, bondingstrength between the first and second multilayer capacitors 100 and 101and bonding strength between the first multilayer capacitor 100 and thefirst metal frame 140 may be improved.

In addition, a conductive bonding layer 164 may be disposed between thesecond head portion 132 a of the second external electrode 132 of thefirst multilayer capacitor 100 and the second connection portion 151 ofthe second metal frame 150, and a conductive bonding layer 162 may bedisposed between the second band portion 132 b of the second externalelectrode 132 and the fourth band portion 132 b′ of the fourth externalelectrode 132′ facing each other in the Z direction. Thus, bondingstrength between the first and second multilayer capacitors 100 and 101and bonding strength between the first multilayer capacitor 100 and thesecond metal frame 150 may be improved.

In the capacitor array, two multilayer capacitors may be stacked from alower end in the Z direction in such a manner that portions of bandportions, facing each other, may overlap each other in the Z direction.

In the present embodiment, a portion of the first band portion 131 b ofthe first external electrode 131 of the first multilayer capacitor 100and a portion of the third band portion 131 b′ of the third externalelectrode 131′ of the second multilayer capacitor 101 may overlap eachother in the Z direction.

In addition, a portion of the second band portion 132 b of the secondexternal electrode 132 of the first multilayer capacitor 100 and aportion of the fourth band portion 132 b′ of the fourth externalelectrode 132′ of the second multilayer capacitor 101 may overlap eachother in the Z direction.

In the present embodiment, ⅔≤B/A in which ‘A’ is a length of the firstband portion 131 b of the first multilayer capacitor 101 in the Xdirection, and ‘B’ is a length of the third band portion 131 b′,overlapping the first band portion 131 b in the Z direction, in the Xdirection.

The length B of the third band portion 131 b′, overlapping the firstband portion 131 b in the Z direction, in the X direction may be, indetail, 0.4 mm or more.

In the present disclosure, ⅔≤B/A in which ‘A’ is a length of the secondband portion 132 b of the first multilayer capacitor 101 in the Xdirection and ‘B’ is a length of the fourth band portion 132 b′,overlapping the second band portion 132 b in the Z direction, in the Xdirection.

The length B of the fourth band portion 132 b′, overlapping the secondband portion 132 b in the Z direction, in the X direction may be, indetail, 0.4 mm or more.

FIG. 7 is a cross-sectional view of an electronic component according toanother exemplary embodiment of the present disclosure.

Referring to FIG. 7 , a first metal frame 140′ may further include afirst bonding portion 143.

The first bonding portion 143 may be bent to extend outwardly of a firstconnection portion 141 from an upper end of the first connection portion141 in an X direction.

The first bonding portion 143 may be bonded to a third band portion 131b′ of a second multilayer capacitor 101, disposed above in a capacitorarray, to support the third band portion 131 b′.

In this case, a conductive bonding layer 166 may be disposed between thefirst bonding portion 143 and the third band portion 131 b′ of thesecond multilayer capacitor 101.

The conductive bonding layer 166 may be integrally connected to aconductive bonding layer 163 disposed between the first connectionportion 141 and a first head portion 131 a.

A second metal frame 150′ may further include a second bonding portion153.

The second bonding portion 153 may be bent to extend outwardly of asecond connection portion 151 from an upper end of the second connectionportion 151 in the X direction.

The second bonding portion 153 may be bonded to a fourth band portion132 b′ of a second multilayer capacitor 101, disposed above in thecapacitor array, to support the fourth band portion 132 b.

In this case, a conductive bonding layer 167 may be disposed between thesecond bonding portion 153 and a fourth band portion 142 b′ of thesecond multilayer capacitor 101.

The conductive bonding layer 167 may be integrally connected to aconductive bonding layer 164 disposed between the second connectionportion 151 and a second head portion 132 a.

In the present embodiment, the first multilayer capacitor 100′ may beformed to have a smaller size than in the exemplary embodiment of FIG. 5such that the first and second metal frames 140′ and 150′ include thefirst and second bonding portions 143 and 153, respectively.

Therefore, a portion in which the first band portion 131 b and the thirdband portion 131 b′ overlap each other in a Z direction may besignificantly small or may not exist. In addition, a portion in whichthe second band portion 132 b and the fourth band portion 132 b′ overlapeach other in the Z direction may be significantly small or may notexist.

In the present embodiment, in the case of the above-described structure,adhesive strength between the first multilayer capacitor 100′ and thesecond multilayer capacitor 101 may be reduced, as compared with theexemplary embodiment of FIG. 5 .

Accordingly, a non-conductive bonding layer 165 may be disposed in anempty space between an upper surface of a capacitor body of the firstmultilayer capacitor 100′ and a lower surface of a capacitor body of thesecond multilayer capacitor 101.

The non-conductive bonding layer 165 may compensate for the reducedadhesive strength between the first and second multilayer capacitors100′ and 101.

The non-conductive bonding layer 165 may include epoxy, or the like, butthe present disclosure does not limit a material of the non-conductivebonding layer 165.

FIG. 8 is a perspective view illustrating a schematic structure of anelectronic component according to another exemplary embodiment, and FIG.9 is a cross-sectional view taken along line III-III′ of FIG. 8 .

Referring to FIGS. 8 and 9 , a first metal frame 140″ may include afirst extension portion 144 and a first auxiliary connection portion145.

The first auxiliary connection portion 145 may be bonded to a third headportion 131 a′ of a second multilayer capacitor 101 disposed above in acapacitor array. To this end, the first auxiliary connection portion 145may be bent to extend upwardly of the first extension portion 144 froman end portion of the first extension portion 144 in a Z direction.

In this case, a conductive bonding layer 168 may be disposed between thefirst auxiliary connection portion 145 and the third head portion 131 a′of the second multilayer capacitor 101 disposed above in the capacitorarray.

The conductive bonding layer 168 may be integrally connected to aconductive bonding layer 163, disposed between a first connectionportion 141 and a first head portion 131 a, and a conductive bondinglayer 161 disposed between first and third band portions 131 b and 131b′

The first auxiliary connection portion 145 may be formed to expose aportion of the third head portion 131 a′ of the second multilayercapacitor 101.

For example, a length of the first auxiliary connection portion 145 inthe Z direction may be less than a length of the third head portion 131a′ in the Z direction.

A second metal frame 150″ may include a second extension portion 154 anda second auxiliary connection portion 155.

The second auxiliary connection portion 155 may be bonded to a fourthhead portion 132 a′ of the second multilayer capacitor 101 disposedabove in the capacitor array. To this end, the second auxiliaryconnection portion 155 may be bent to extend upwardly of the secondextension portion 154 from an end portion of the second extensionportion 154 in the Z direction.

In this case, a conductive bonding layer 169 may be disposed between thesecond auxiliary connection portion 155 and the fourth head portion 132a′ of the second multilayer capacitor 101 disposed above in thecapacitor array.

The conductive bonding layer 169 may be integrally connected to aconductive bonding layer 164, disposed between a second connectionportion 151 and a second head portion 132 a, and a conductive bondinglayer 162 disposed between second and fourth band portions 132 b and 132b′.

The second connection portion 155 may be formed to expose the fourthhead portion 132 a′ of the second multilayer capacitor 101.

For example, a length of the second auxiliary connection portion 155 inthe Z direction may be less than a length of the fourth head portion 132a′ in the Z direction.

FIG. 10 is a cross-sectional view illustrating a state in which theelectronic component of FIG. 5 is mounted on a board.

Referring to FIG. 10 , a mounting board according to the presentdisclosure may include a board 210 and first and second connection pads221 and 222 disposed to be spaced apart from each other on an uppersurface of the board 210.

In the present embodiment, the electronic component may be connected inthe state, in which first and second mounting portions 142 and 152 offirst and second metal frames 140 and 150 are in contact with first andsecond electrode pads 221 and 222, respectively, to be mounted on theboard 210.

In this case, the first mounting portion 142 may be bonded to the firstelectrode pad 222 by a solder 231 be electrically and physicallyconnected thereto, and the second mounting portion 152 may be bonded tothe second electrode pad 222 by a solder 232 to be electrically andphysically connected thereto.

A multilayer capacitor according to the related art has a structure inwhich an external electrode of the multilayer capacitor and a board arein direct contact with each other due to a solder.

Accordingly, since thermal or mechanical deformation occurring in theboard is directly transferred to the multilayer capacitor, it may bedifficult for the multilayer capacitor to secure a high level ofreliability.

In the electronic component according to the present embodiment, thefirst and second metal frames 140 and 150 may be bonded to both endportions of a first multilayer capacitor 100, respectively, to securespacing between the multilayer capacitor 100 and the board 210.

Thus, stress from the board 210 is not directly transferred to themultilayer capacitor 100 when the electronic component 101 is mounted onthe board 210. As a result, thermal reliability, electrical reliability,mechanical reliability, and the like of the electronic component 101 maybe improved.

Additionally, in the electric component according to the presentembodiment, the second multilayer capacitor may be stacked on the firstmultilayer capacitor to secure high capacitance.

In the case of a stack-type electronic component according to therelated art, a total length of the electronic component is increased bythicknesses of a metal frame and a conductive bonding layer. Thus, amounting area is increased by the increased length of the electroniccomponent when the electronic component is mounted on a board, and adesign of an electronic pad of the board should be changed.

In the present embodiment, a length of the first multilayer capacitor100, close to a mounting surface of the board, in an X direction is lessthan a length of the second multilayer capacitor 101 in the X direction.

Accordingly, a total length of the electronic component in the Xdirection is similar to or less than the length of the second multilayercapacitor in the X direction. As a result, the mounting area may not beincreased when the electronic component is mounted on the board, and anelectrode pad of the board may be used, as it is, without changing adesign of the electrode pad.

FIG. 6 is a graph illustrating that a detachment rate and relativeequivalent series resistance (ESR) of a multilayer capacitor disposedabove vary depending on an overlapping length of band portions,vertically facing each other, in a capacitor array of an electroniccomponent according to an exemplary embodiment of the presentdisclosure.

The following test will be described, based on a length at which firstand third band portions overlap each other. However, the description ofthe following test may be equivalently applied to a length at whichsecond and fourth band portions overlap each other.

ESR of an electronic component, including vertically stacked first andsecond multilayer capacitors, and adhesive strength between the firstand second multilayer capacitors of the electronic component are testedafter 20 electronic components are mounted on a printed circuit board(PCB) such that each overlapping length B, at which a first band portionand a third band portion overlap each other in a Z direction, has adifference of 0.1 mm.

In this case, the overlapping length B, at which the first band portionand the third band portion overlap each other, may be measured using anoptical microscope in a direction, perpendicular to a mounting surfaceof the board.

The ESR of the electronic component depending on the overlapping lengthB, at which the first band portion and the third band portion overlapeach other, is measured as relative ESR depending on a decrease in theoverlapping length B, based on ESR when the overlapping length B is 0.6mm, and is illustrated in FIG. 6 .

A minimum size of a multilayer capacitor, capable of performing amulti-stacking process, is about 1.6 mm in length and about 0.8 mm inwidth.

In this case, a band portion of an external electrode of a multilayercapacitor has a length of 0.6 mm or more. For this reason, 0.6 mm is setas a reference value of the length B when the first and third bandportions fully overlap each other.

In a test for adhesive strength between the first and second multilayercapacitors, in an electronic component mounted on a PCB, force of 15Nwas applied to the second multilayer capacitor at a rate of 1 mm/min for10 seconds. A case in which the second multilayer capacitor was detachedfrom the first multilayer capacitor was evaluated as detachment, and adetachment rate thereof is illustrated in FIG. 6 .

As can be seen from FIG. 6 , when an overlapping length B, at which thefirst band portion and the third band portion overlap each other, was0.4 mm or more, the second multilayer capacitor was not detached fromthe first multilayer capacitor and was maintained in a stable couplingstate. When the overlapping length B, at which the first band portionand the third band portion overlap each other, was less than 0.3 mm, adetachment rate of the second multilayer capacitor was rapidlyincreased.

In the case of the present embodiment, electrical and physicalconnectivity between first and second external electrodes of the firstmultilayer capacitor and third and fourth external electrodes of thesecond multilayer capacitor may be deteriorated due to a difference insizes between the first multilayer capacitor and the second multilayercapacitor. Thus, ESR of the electronic component may be increased and achip detachment rate may also be increased.

For example, since a bonding area between electrically conductive firstand third band portions is decreased as the overlapping length B isdecreased, ESR is increased.

In the case in which ESR is 100% when the overlapping length B, at whichthe first and third band portions fully overlap each other, is 0.6 mm,the ESR is increased more than twice a reference value when theoverlapping length B is 0.2 mm or less.

In addition, when the overlapping length B is 0.4 mm or more, the ESR isless than 1.5 times the reference value.

Therefore, when a level, at which ESR-dependent heating characteristicsof the multilayer capacitor is significantly increased, is 1.5 times thereference value, the overlapping length B may be, in detail, 0.4 mm ormore to secure stability of the electronic component to a certain levelor higher.

As described above, durability of a multilayer capacitor againstvibrations and deformation may be improved, and a plurality ofmultilayer capacitors may be stacked to increase capacitance of anelectronic component. In addition, an electronic component may be usedwithout increasing a mounting area when it is mounted on a board andchanging a design of an electrode pad of the board.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentdisclosure as defined by the appended claims.

What is claimed is:
 1. An electronic component comprising: a capacitorarray in which a plurality of multilayer capacitors, each including acapacitor body and a pair of external electrodes disposed on endportions of the capacitor body opposing in a first direction, arestacked in a second direction perpendicular to the first direction, anda length in the first direction of a multilayer capacitor, disposed on alower end in the second direction is less than a length in the firstdirection of another multilayer capacitor; and a pair of metal frames,respectively disposed to be connected to the pair of external electrodesof the multilayer capacitor disposed on the lower end so as to overlapthe another multilayer capacitor in the second direction, wherein theexternal electrode comprises: a head portion disposed on one surface ofthe capacitor body in the first direction; and a band portion extendingfrom the head portion to portions of upper and lower surfaces of thecapacitor body, wherein the metal frame comprises: a connection portionconnected to the head portion; and a mounting portion bent to extendfrom a lower end of the connection portion in the first direction, andwherein the connection portion overlaps the another multilayer capacitorin the second direction.
 2. The electronic component of claim 1, whereina conductive bonding layer is disposed between band portions, facingeach other, in multilayer capacitors adjacent to each other in thesecond direction.
 3. The electronic component of claim 1, wherein themounting portion is spaced apart from a lower end of the capacitorarray.
 4. The electronic component of claim 1, further comprising: aconductive bonding layer disposed between the connection portion and thehead portion.
 5. The electronic component of claim 1, wherein twomultilayer capacitors are stacked from a lower end of the capacitorarray in the second direction in such a manner that portions of bandportions, facing each other, overlap each other in the second direction.6. The electronic component of claim 5, wherein ⅔≤B/A, in which A is alength of the band portion of the multilayer capacitor, disposed on thelower end, in the first direction, and B is a length of the bandportions, overlapping each other in the second direction, in the firstdirection.
 7. The electronic component of claim 5, wherein a length ofthe band portions, overlapping each other in the second direction, inthe first direction is 0.4 mm or more.
 8. The electronic component ofclaim 1, wherein the metal frame comprises a bonding portion, bent toextend from an upper end of the connection portion in the firstdirection, allowing the metal frame to be bonded to a band portion of amultilayer capacitor disposed on an upper side in the capacitor array.9. The electronic component of claim 8, further comprising: a conductivebonding layer disposed between the bonding portion and the band portionof the multilayer capacitor disposed on the upper side in the capacitorarray.
 10. The electronic component of claim 8, wherein the metal framecomprises: an extension portion bent to extend from an upper end of theconnection portion in the first direction; and an auxiliary connectionportion, bent to extend from the extension portion in the seconddirection, to be bonded to the head portion of the multilayer capacitordisposed on the upper side in the capacitor array.
 11. The electroniccomponent of claim 10, further comprising: a conductive bonding layerdisposed between the auxiliary connection portion and the head portionof the multilayer capacitor disposed on the upper side in the capacitorarray.
 12. The electronic component of claim 10, wherein the auxiliaryconnection portion is formed to expose a portion of the head portion ofthe multilayer capacitor disposed on the upper side in the capacitorarray.
 13. An electronic component, comprising: a first capacitor havinga first capacitor body, a first external electrode disposed on a firstsurface of the first capacitor body and a second external electrodedisposed on a second surface of the first capacitor body opposing thefirst surface in a length direction, the first capacitor having a firstlength in the length direction; a first metal frame having an innersurface thereof contacting the first external electrode, and a secondmetal frame having an inner surface thereof contacting the secondexternal electrode, the first and second metal frames extendingdownwardly in a thickness direction; and a second capacitor disposedabove the first capacitor in the thickness direction, the secondcapacitor having a second capacitor body, a third external electrodedisposed on a first surface of the second capacitor body and a fourthexternal electrode disposed on a second surface of the second capacitorbody opposing the first surface in the length direction, the secondcapacitor having a second length in the length direction, the secondlength being greater than the first length, wherein at least one of thefirst or second metal frames entirely overlaps the second capacitor inthe thickness direction.
 14. The electronic component of claim 13,wherein the first and second external electrodes extend over a portionof a pair of surfaces of the first capacitor body opposing each other ina thickness direction to form first and second band portions, the thirdand fourth external electrodes extend over a portion of a pair ofsurfaces of the second capacitor body opposing each other in a thicknessdirection to form third and fourth band portions.
 15. The electroniccomponent of claim 14, wherein the second capacitor is disposed abovethe first capacitor such that a portion of the first and third bandportions overlap in the thickness direction and a portion of the secondand fourth band portions overlap in the thickness direction.
 16. Theelectronic component of claim 15, wherein ⅔≤B/A, in which A is a lengthof the first or second band portions in the length direction, and B is alength in the length direction of the overlapping portion of the firstand third band portions, or the second and fourth band portions.
 17. Theelectronic component of claim 14, wherein a conductive bonding layer isdisposed between the first and third band portions, and the second andthird band portions so as to form an electrical connection between thefirst and second capacitors.
 18. The electronic component of claim 13,wherein the second capacitor comprises a plurality of multilayercapacitors stacked in the thickness direction.